Benchmarking against the forefront and engaging customers | Tianzhiye Intelligent makes its appearance at PACK EXPO 2026 Chicago, stepping up its layout in the North American market.

PACK EXPO International 2026

From 18 to 21 October 2026, PACK EXPO International 2026—a major global exhibition for the packaging industry—was held in Chicago, USA. The TOUPACK team travelled to North America to participate in this international packaging event and, whilst on this trip, conducted on-site visits to regional clients and technical exchange activities to further strengthen the company’s business presence in the North American market.

Uniting at a Major International Exhibition · Expanding into Global Markets

PACK EXPO International 2026 is the largest and most influential specialist exhibition in North America’s packaging and processing sector. It brings together end manufacturers, equipment integrators and supply chain decision-makers from sectors such as food and fast-moving consumer goods (FMCG), serving as a key platform for showcasing automated packaging technologies and facilitating multinational projects.

At the Exhibition

TOUPACK specialises in the research, development and implementation of intelligent weighing and complete packaging production lines. With proven experience in delivering projects for major global food groups—including having developed production line projects for the world’s leading potato crisp brand—the company possesses an in-depth understanding of the stringent standards required by food factories, particularly those producing puffed snacks, in terms of high-speed weighing and continuous, stable mass production. As such, it is well-positioned to provide overseas clients with customised intelligent weighing and complete packaging systems.

Showcasing at the Exhibition: Exploring the Path to Smart Manufacturing Together

During this business trip to the US, TOUPACK will target the North American market to showcase the practical applications of its intelligent weighing and packaging technologies. The company will engage in in-depth discussions with attending food manufacturers and industry partners on topics such as the intelligent upgrading of production lines, reducing production costs whilst increasing efficiency, and compliance-driven production line design. The aim is to explore optimisation solutions for high-capacity packaging production lines and identify new opportunities for cross-border collaboration.

Deepening Engagement in the North American Market・Empowering Industrial Upgrading

Following the exhibition, the TOUPACK team will visit both existing and new clients across North America. They will conduct on-site visits to production facilities to assess the current status of clients’ production lines first-hand. Based on the specific challenges faced in their operations, the team will discuss solutions for production line upgrades, project implementation, technical support and long-term service plans. By assisting North American food manufacturers in achieving automated upgrades to their weighing and packaging production lines, TOUPACK looks forward to collaborating with industry partners in North America to jointly pioneer a new future for the intelligent packaging industry.